焊料槽

例句

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1.
If this happens the Fe concentration will increase rapidly and Fe-crystals can be seen on the surface of the solder pot.
如果发生这种情况，铁浓度将快速上升，并且会在焊料槽表面上看到铁结晶。
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2.
This phenomena can be reduced or eliminated by reducing the amount of preheat added to the board and a higher pot temperature.
这种现象可以通过降低加给线路板的预热量并提高焊料槽的温度予以消除。
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3.
Analysis of the solder pot is done by means of Atomic Absorption Spectrophotometric (AAS) or Inductive Couple Plasma (ICP) .
对焊料槽的分析是通过原子吸收分光光度（AAS）或电感耦合等离子（ICP）方式实现的。
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4.
Silver and copper tend to not dross out of the solder pot .
银和铜不易在焊料槽中生成残渣。
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5.
If the Fe concentration increases in the solder pot this indicates that the solder pot is slowly dissolving because of the Pb-free alloy.
如果焊料槽中的铁浓度提高，则表明焊料槽因为无铅合金而缓慢溶解。
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6.
In this case the solder pot has to be changed or coated and the solder bar has to be replaced.
在这种情况下，必须更换或涂抹焊料槽，并更换焊料棒。
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7.
There is no industry control limits for Copper and Lead in SnAgCu solder pot.
目前行业中没有用于SnAgCu焊料槽中铜和铅的控制极限。
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8.
Only partial removal of the contaminated solder pot will get the Pb concentration back below 0. 1% wt.
只有将被污染的焊料槽部分取下才可以让铅浓度恢复到重量0.1%以下。
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9.
Adding pure tin to the pot will control the alloy.
向焊料槽中添加纯锡可以对合金进行控制。
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