The U.S. Department of Energy will contribute $179 million for three new Microelectronics Science Research Centers, which will focus on research into solutions that bridge sensing, edge processing, AI ...

A new technical paper titled “Multifunctional 2D FETs exploiting incipient ferroelectricity in freestanding SrTiO3 ...

Experts at the Table: The automotive ecosystem is in the midst of an intense evolution as OEMs and tiered providers grapple with how to deal with legacy technology while incorporating ever-increasing ...

In 2024, hot topics included challenges involving chiplets and heterogeneous integration, AI, data management, MCUs, power semis, software-defined vehicles, sensors, adaptive test, yield tracking, ...

A technical paper titled “Recent progress in spin-orbit torque magnetic random-access memory” was recently published by imec. “Spin-orbit torque magnetic random-access memory (SOT-MRAM) offers promise ...

A new technical paper titled “Memory-Centric Computing: Recent Advances in Processing-in-DRAM” was published by researchers at ETH Zurich. “Memory-centric computing aims to enable computation ...

A new technical paper titled “Ammonia Plasma Surface Treatment for Enhanced Cu–Cu Bonding Reliability for Advanced Packaging Interconnection” was published by researchers at Myongji University. “With ...

A new technical paper titled “Semi-Supervised Learning with Wafer-Specific Augmentations for Wafer Defect Classification” was published by researchers at Korea University. “Semi-supervised learning ...

A new technical paper titled “Next generation Co-Packaged Optics Technology to Train & Run Generative AI Models in Data Centers and Other Computing Applications” was published by researchers at IBM.

A new technical paper titled “Enabling Efficient Wearables: An Analysis of Low-Power Microcontrollers for Biomedical Applications” was published by researchers at EPFL. “Breakthroughs in ...

Battling labor shortages, faster ramp rates, and data overload, the process of designing and building greenfield fabs requires a combination of tech tools, failing earlier approaches and superior ...