As computing shifts from single-chip processors to multi-chip systems, traditional communication methods, such as ...

Sivers Semiconductors will lead the 5G/6G Technology Program, focusing on beamformer IC and array design for FR3 frequencies (7-15 GHz) to enhance future 5G and 6G networks. The program's end ...

A critical element of DMAs is the differential beamformer, traditionally designed to ensure that the designed beampattern closely matches the desired target directivity pattern. However, such ...

Sivers Semiconductors announced receiving first-year funding of $6 million from the Northeast Microelectronics Coalition ...

Therefore, a hybrid reinforcement learning scheme is proposed in this work. First, the semidefinite relaxation and Gaussian randomization techniques are leveraged to obtain the approximate solution of ...

EnSilica, an ASIC design and supply solution provider, has announced an extended partnership with data converter IP supplier Omni Design Technologies for chips targeted at advanced wireless ...

Amkor-TSMC deal; new law speeds semiconductor projects; NSTC launch; quartz supply; chiplet partitioning; semiconductor ...

The companies are expanding their collaboration where Omni Design’s advanced multi-gigahertz Swift™ data converters and supporting cores are deployed in EnSilica’s turnkey ASIC solutions for advanced ...

近日，电子科技大学博士毕业生、新加坡南洋理工大学博士后王文昊和同事造出一种新型波束形成器，借此攻克太赫兹无线通信中长期存在的高路径损耗问题，相关论文发表于 Nature。

该团队打造的这种与互补金属氧化物半导体兼容的太赫兹拓扑光子集成电路，能用于大规模波束的高效形成，其能支持大规模的单输入多输出和多输入多输出，有望实现每秒数万亿比特的 6G 无线通信。