Advanced packaging technologies and high-bandwidth memory (HBM) have fueled a surge in global chip demand. Beneath the ...

ASE Technology is committing $200 million to test a new method of chip packaging that replaces traditional round wafers with ...

ScAlMgO 4 substrates provide a foundation for producing LEDs with lattice-matched, indium-rich quantum wells A collaboration ...

Water-based adhesives face several challenges despite their environmental benefits. One major issue is that achieving high ...

Substrates for Extreme Ultraviolet (EUV) lithography BOSTON, MA, UNITED STATES, February 18, 2025 /EINPresswire / -- UniversityWafer, Inc., a ...

GlobalWafers chairperson Doris Hsu reports that prices for mainstream 6-inch silicon carbide (SiC) substrates have stabilized ...

在格陵兰冰盖上，基于钻孔光纤的观测揭示了一种与粘性流动理论不符的脆性变形模式，其长度尺度与现代冰盖模型的分辨率相似：即在地表无法观测到的冰震级联效应。冰震级联在火山来源杂质附近成核，促进晶界开裂，表现为晶体尺度原初塑性的宏观形式。

An international team has developed a new technique to recycle perovskite solar cells (PSC) made on glass substrates using a ...

Microsoft sees a path to million qubit quantum computers within years via an entirely new kind of quantum computer using a ...