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THE CHOSUNILBO on MSNWhat’s next after HBM? Chipmakers bet on glass substratesAdvanced packaging technologies and high-bandwidth memory (HBM) have fueled a surge in global chip demand. Beneath the ...
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tom's Hardware on MSNASE developing square packaging substrate tech to replace round wafersASE Technology is committing $200 million to test a new method of chip packaging that replaces traditional round wafers with ...
ScAlMgO 4 substrates provide a foundation for producing LEDs with lattice-matched, indium-rich quantum wells A collaboration ...
Water-based adhesives face several challenges despite their environmental benefits. One major issue is that achieving high ...
Substrates for Extreme Ultraviolet (EUV) lithography BOSTON, MA, UNITED STATES, February 18, 2025 /EINPresswire / -- UniversityWafer, Inc., a ...
Photo imageable dielectric materials could replace the laser drilled build-up film via process used in glass substrates.
GlobalWafers chairperson Doris Hsu reports that prices for mainstream 6-inch silicon carbide (SiC) substrates have stabilized ...
(MENAFN- EIN Presswire) The GaN Diamond Semiconductor Substrates market is set for growth, fueled by advances in power Electronics and the demand for better heat management. As Per the SNS Insider ...
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