Whats next after HBM Chipmakers bet on glass substrates Glass substrates emerge as a key contender in the race for next-gen ...
tom's Hardware on MSN1d
ASE developing square packaging substrate tech to replace round wafersASE Technology is committing $200 million to test a new method of chip packaging that replaces traditional round wafers with ...
An international team has developed a new technique to recycle perovskite solar cells (PSC) made on glass substrates using a ...
Competition for an early lead in glass substrates for computer chip manufacturing is heating up, with component firms projecting that the commercialization of this so-called "next-generation material" ...
Another drawback of producing red LEDs on ScAlMgO 4 is the high cost of the substrate. Team spokesman Kazuhiro Ohkawa told ...
The Japanese AIST Group (consisting of National Institute of Advanced Industrial Science and Technology and AIST Solutions) ...
Photo imageable dielectric materials could replace the laser drilled build-up film via process used in glass substrates.
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