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조선일보 on MSNWhat's next after HBM? Chipmakers bet on glass substratesWhats next after HBM Chipmakers bet on glass substrates Glass substrates emerge as a key contender in the race for next-gen ...
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tom's Hardware on MSNASE developing square packaging substrate tech to replace round wafersASE Technology is committing $200 million to test a new method of chip packaging that replaces traditional round wafers with ...
IT is well known that as the concentration of substrate molecules is increased, other conditions being kept constant, the rate of catalysis of a reaction by an enzyme reaches a maximum value.
Competition for an early lead in glass substrates for computer chip manufacturing is heating up, with component firms projecting that the commercialization of this so-called "next-generation material" ...
The Japanese AIST Group (consisting of National Institute of Advanced Industrial Science and Technology and AIST Solutions) ...
Another drawback of producing red LEDs on ScAlMgO 4 is the high cost of the substrate. Team spokesman Kazuhiro Ohkawa told ...
Scientists have uncovered the equipment that enables bacteria to survive exposure to antibiotics: a shuttling mechanism that helps a complex of proteins pump out a wide spectrum of antibiotics along ...
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