The global copper foil industry size is predicted to register a CAGR of 7.4% over the forecast period, as per FMI’s analysis.

AUSTIN, TX – High Density Packaging User Group (HDP) is pleased to announce that Dynamic Electronics Co., Ltd. (Dynamic) has become a member.

The compound semiconductor materials market size is predicted to be worth USD 24.31 billion in 2023 and rise to USD 69.02 ...

October 10, 2024 – Tianqi Lithium, a Chengdu-based Chinese company specializing in lithium-based new energy materials, made ...

Although no one likes a know-it-all, they dominate the Internet. The Internet began as a vast repository of information. It quickly became a breeding ground for self-proclaimed experts seeking what ...

The swing state’s Democratic leaders want to channel historic manufacturing prowess toward clean energy. Success will hinge on the November election. Michigan bets on EVs to revive its economy — and ...