Electronic components are changing rapidly, and the average lifecycle of an individual component is getting shorter. While ...

Collaboration with CEA and Tohoku University to achieve practical application of neuromorphic devices able to reduce power ...

U.K.-based Pragmatic Semiconductor has developed a bendable non-silicon RISC-V microprocessor, as described in the published ...

Collaboration to allow simple, fast design of next-gen industrial & consumer IoT applications augmented by edge AI ...

BINDER Special flange components act as plug-in partners for the PBC15 cable connector. The combination enables tailored solutions for a wide range of applications, such as in-drive technology. The ...

KYOCERA AVX KGU Series ultra-low-ESR RF multilayer ceramic chip capacitors (MLCCs) deliver repeatable RF performance, while delivering multiple performance advantages optimized for communications ...

IPC Builds (formerly SummerCom), taking place from October 5-10, 2024, at the McKimmon Center in Raleigh, North Carolina. IPC Builds focuses on IPC standards development committee meetings and ...

The Semiconductor Industry Association (SIA) today announced global semiconductor sales hit $53.1 billion during the month of ...

STACKPOLE RNWA series automotive grade thin film wide termination chip resistors serve precision applications requiring surface mount chip devices with high power demands, self-heating often leads to ...

PICO TECHNOLOGY PicoScope 3000E Series MSO (Mixed-Signal Oscilloscope) features user-friendly design, with added digital channel capability, making them suitable for testing and debugging mixed-signal ...