Extreme-ultraviolet (EUV) lithography at 13.5 nm is expected to be introduced in high-volume semiconductor chip production over the next three years. Research is now underway to investigate sub-10 ...
This platform gives TSMC the opportunity to take the next step forward in exploring multiple e-beam technology as a lithography option at 22 nanometer and more advanced process nodes. Multiple e-beam ...
China has spent years pursuing technology self-sufficiency in semiconductors, but its progress in producing the lithography systems required to reliably mass produce advanced chips remains slow.
While newer technologies like extreme ultraviolet (EUV) lithography machines are used to produce the most advanced chips. Xiang Ligang, director-general of the Information Consumption Alliance ...
This week the Japanese company delivered its FPA -1200NZ2C nanoimprint lithography system to the ... in response to growing industry interest in advanced heterogeneous integration.' ...