Surfx's Dr. Robert Hicks takes us on a journey of discovery around plasma, and the potential it has to revolutionize the ...

This position is for Yield Engineer in GlobalFoundries India center at Bangalore, supporting 300mm wafer fabs in Malta, US ...

As electronic devices become increasingly miniaturized, heat management at the nanoscale emerges as a challenge, especially for devices operating in sub-microns. Traditional heat conduction models ...

Two bottled water plants in the eastern United States previously partnered with us to solve challenges in their spring, bottling, and bottle-washing processes. These two customers partnered with us ...

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A compressor hums, an air conditioning system rattles, a railway carriage chassis clatters, sending reverberations through ...

In the major European IMOCO4.E project, coordinated by Sioux Technologies and concluded last month, work was done on ...

Materials researchers have created a new composite material that combines two incompatible properties: stiff yet with a high damping capacity.

ARM® Logic IP solutions are the ideal choice for advanced, deep submicron SoC designs. The Standard Cell Libraries are complemented by Power Management Kit and ECO Kit extensions, delivering optimal ...

ARM® Logic IP solutions are the ideal choice for advanced, deep submicron SoC designs. The Standard Cell Libraries are complemented by Power Management Kit and ECO Kit extensions, delivering optimal ...