Fast forward to today, a new systems integration platform has emerged that fuses packaging with traditional approaches to PCB ...

Longi Green Energy recently revealed that based on the current development of BC cell technology, it expects to drive down BC ...

Scientists in the Netherlands proposed a new testing scheme for recycling silicon from end-of-life photovoltaic panels. Their ...

随着TOPCon电池对于钝化接触理念的深入实践，从进一步提升电池转换效率的角度，全钝化接触设计成为光伏电池下一阶段发展的必争之地。本次报告中，帝科DKEM®从TOPCon与TBC电池金属化的比较视角，详细阐述了当前TBC电池n区poly、p区poly ...

Custom substrates for prototype development and production, particularly for SSD's, power and RF devices.

Researchers at the Fraunhofer Institute for Solar Energy Systems ISE (Fraunhofer ISE) in Germany are developing copper metallization technology to avoid using silver in perovskite-silicon tandem ...

The first CMOS circuits to incorporate backside power connections are likely to be based on stacked nanosheet transistors, but further down the road, planners envision complementary transistors (CFETs ...

在玻璃金属化完成后的玻璃又称做“Glass Core”，制程涉及 TGV（Through-Glass Via）、湿蚀刻（Wet Etching）、AOI 光学检测、镀膜（Sputtering）及电镀（Plating）。 关于玻璃基板何时投放市场，之前的一篇报道披露，主要制造商都把解决方案投放市场的时间窗口定在了 2025-2026 年，其中英特尔和台积电走在了前列。